Embedded thermoelectrics: Cooling ICs in harsh environments

By	Seri Lee, PhD Nextreme Thermal Solutions, Inc.

The demand for small, compact electronic devices with increased capabilities and functionality is a driving force in today’s technology markets. Whether the device is manufactured for the consumer, military, aerospace, medical, communications, or automotive markets, its evolutionary path is the same – smaller and faster with more functionality. Design engineers face many challenges in meeting this continuously raised bar. A particularly vexing problem is removing heat from integrated circuits.

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