The need for more advanced and complex radiation-hardened semiconductors is ever-increasing, and with this need comes the challenge of testing and validating new technology libraries as well as sophisticated devices incorporating these components. In particular, diagnosing Single Event Effects (SEEs) presents a dilemma, considering that such diagnostics require real-time on-chip visibility which is not available with traditional methods. Boeing recognized this difficulty when faced with the testing of their Radiation Hardened by Design technology on the IBM 90nm process. In response, Boeing turned to DAFCA to equip such a design with embedded instrumentation so that they could observe and analyze – in real time – the formerly inaccessible confines of the device.