ARTICLES & TOPICS
NEWS & PRODUCTS
WHITE PAPERS
VENDORS
E-CAST SCHEDULE
> GO  
Home > News >
More Military Embedded Systems News


Other News:
VME/Critical
Embedded Computing
DSP, FPGA CompactPCI
AdvancedTCA
Small Form Factors
Magazine >

About the Magazine
Editorial Topics
Free Subscription
Search Articles
Search Products
Contact Information
Columns

Industry Analysis
In the System
Field Intelligence
Daily Briefing
Legacy Software Migration
Departments

Webcasts

Upcoming E-casts
Archived E-casts
Submissions

Submit a Press Release
Submit a New Product
Submit an Article for Review
Vendors/Sponsors

Preferred Vendors
Related Resources
NEW! Sponsor an E-cast
Upcoming Issue
Advertise
Editorial Calendar
Media Kits






 Contracts
BAE Systems selects VMETRO Conduction Cooled Processors
3 years 6 months ago

VMETRO has received a contract to supply conduction cooled Phoenix VPF1 digital signal processing boards to BAE Systems in Nashua, NH for the U.S. Army's Tactical Signals Intelligence Payload (TSP) Program. The Phoenix VPF1 Dual PowerPC, Dual Virtex-II Pro FPGA VME/VXS Digital Signal Processors will run the signal processing algorithm as well as perform real-time processing of the sensor data. The initial contract is valued at approximately $500,000. The design is being included in similar programs as part of BAE Systems' common platform initiative.

TSP is a subsystem intended for the Army's tactical Unmanned Aerial Vehicles (UAV). The payload collects and processes radio frequency energy which will be displayed on the payload operator's work station in a ground processing facility. The system provides the ground tactical commander with an airborne collection capability that is responsive to real time emerging operational intelligence requirements. TSP will provide a critical capability to see and understand the enemy on future battlefields. BAE Systems' TSP offering is fully scalable for employment on other platforms, large or small. The offering is based on using predominantly commercially available off-the-shelf hardware components.

“VMETRO was chosen for BAE Systems' TSP Program because their innovative technology provides the performance and scalability needed as well as the deployable capabilities required during the life of this program,” said Eric Vogel, BAE Systems' program manager for TSP. "Furthermore, VMETRO's technical support and value-added applications engineering will enable BAE Systems to deploy these products quickly.”

Source:  VMETRO Inc.

VMETRO Inc in the News

Add to Google Add to My Yahoo!
The most recent VMETRO Inc related headlines are currently shown.   show more
Industry News:
VMETRO Inc...
Technology Partnerships:
VMETRO Inc...
Contracts:
VMETRO Inc...
New Products:
VMETRO Inc...
People:
VMETRO Inc...
Mergers and Acquisitions:
VMETRO Inc...
Conferences and Awards:
VMETRO Inc...
Media and Education:
VMETRO Inc...
Standard Certifications and References:
VMETRO Inc...


©MMX Military Embedded Systems. An OpenSystems Media publication.
About this Magazine and Website | Contact Us | Military Embedded Systems Media Kits