ARTICLES & TOPICS
NEWS & PRODUCTS
WHITE PAPERS
VENDORS
E-CAST SCHEDULE
> GO  
Home > News >
More Military Embedded Systems News


Other News:
VME/Critical
Embedded Computing
DSP, FPGA CompactPCI
AdvancedTCA
Small Form Factors
Magazine >

About the Magazine
Editorial Topics
Free Subscription
Search Articles
Search Products
Contact Information
Columns

Industry Analysis
In the System
Field Intelligence
Daily Briefing
Legacy Software Migration
Departments

Webcasts

Upcoming E-casts
Archived E-casts
Submissions

Submit a Press Release
Submit a New Product
Submit an Article for Review
Vendors/Sponsors

Preferred Vendors
Related Resources
NEW! Sponsor an E-cast
Upcoming Issue
Advertise
Editorial Calendar
Media Kits






 Industry News
Reducing Thermal Risk is a Key Factor for any Programs Success
2 years 4 days ago

With the ever increasing board density and power consumption of today's systems, assumptions pertaining to adequate airflow over each board to prevent sudden and premature failure can no longer be made.

The initial engineering investment related to conducting a comprehensive THERMAL ANALYSIS is far less when compared to the direct and opportunity costs lost after releasing a design which contains serious thermal issues.

For more than 10 years, Hybricon has continually invested in providing strong thermal analysis capabilities. These capabilities utilize two industry leading thermal management software tools: Macroflow™ and Flomerics FLOTHERM™

While the mechanical design is still in the conceptual phase, initial thermal considerations are addressed by using Macroflow™ software. This tool allows for accurate modeling of flow paths through components such as screens, air or liquid filters, power supplies, card arrays, fans or pumps, ducts or tubes, bends, heat sinks or cold plates, and heat exchangers. MacroFlow™ based analysis is very simple and fast in terms of Model definition, computation, and examination of results.

As the mechanical design evolves, Hybricon takes advantage of Flomerics FLOTHERM's™ comprehensive 3D modeling capabilities. This powerful tool enables our engineers to create virtual 3D models of electronic equipment, perform thermal analysis, and test design modifications quickly and easily in the early stages well before any physical prototypes are built. FLOTHERM™ uses advanced CFD (computational fluid dynamics) techniques to predict airflow, temperature and heat transfer in components, boards and complete systems.

During your next electro-mechanical enclosure design, ask yourself if the program can afford to take a system release delay due to thermal management issues. If not, please contact Hybricon at 1-877-Hybricon and be assured your next design will meet the necessary thermal requirements.

For more information please contact:

Courtney Burden

Marketing Associate

cburden@hybricon.com

Hybricon Corporation

12 Willow Rd., Ayer, MA 01432

Tel: (978) 772 5422

Fax: (978) 772-2963

E-Mail: info@hybricon.com


heat transfer air in the News

Add to Google Add to My Yahoo!
The most recent heat transfer air related headlines are currently shown.   show more
Industry News:
heat transfer air...
Technology Partnerships:
heat transfer air...
Contracts:
heat transfer air...
New Products:
heat transfer air...
People:
heat transfer air...
Mergers and Acquisitions:
heat transfer air...
Conferences and Awards:
heat transfer air...
Media and Education:
heat transfer air...
Standard Certifications and References:
heat transfer air...


©MMX Military Embedded Systems. An OpenSystems Media publication.
About this Magazine and Website | Contact Us | Military Embedded Systems Media Kits