For Immediate Release

Contacts: Mark Occhionero Elizabeth Firger

CPS Technologies Corporation Gray & Rice Public Relations

508-222-0614 x 242 617-367-0100 ext. 119

marko@alsic.com efirger@gr2000.com

AlSiC Flip-chip lids for System in Packaging (SiP) offer higher thermal & structural reliability along with greater packaging functionality & flexibility

CPS Technologies Corporation, the worldwide leader in the design and production of metal matrix composites, offers AlSiC (Aluminum Silicon Carbide) metal matrix composite lids for Systems in Packaging (SiP) IC approaches.

The SiP technology combines multiple die with multiple functionality's into a single package, including components usually found on motherboards to create highly integrated products for optimized cost, size and performance. AlSiCs unique set of material properties and fabrication approaches provide an ideal packaging solution for SiP and offers exceptional design capability for larger multifunctional systems.

AlSiC provides thermal management with device-compatible thermal expansion coefficient (TCE), reducing stresses due to differential TCE of device and assembled materials. AlSiC materials high thermal conductivity value offers efficient thermal dissipation. TCE compatibility and good thermal dissipation improve reliability in SiP approaches by reducing assembly bowing and flexing that can lead to delamination, solder ball or die failure.

AlSiC is a lightweight material with a density 1/3 that of Cu, which significantly reduces the weight per solder ball, improving assembly yield and improving a products in-service vibration tolerance. The lightweight nature of AlSiC allows for less restrictive orientation requirements for larger lid structures. The strength and stiffness is greater than Cu by 1/3. Larger lid packaging is possible due to the higher stiffness and lower density of AlSiC.

The CPS AlSiC net-shape casting fabrication process produces both the composite material and product shape in one process step, resulting in a cost-effective product with greater geometrical capability than stamped Cu lid solutions. The geometrical capability of this casting process enables functional design features, such as pockets for memory chips, capacitors, resistors and cavities or pedestals for the die. Depth of these features is tightly controlled to minimize the thickness of the bond length and assembly, as well as the thermal dissipation variability between assemblies.

The AlSiC cast surface supports various identification methods, including laser marking, paint, ink, and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum.

AlSiC meets the requirements of the Restriction of Hazardous Substances Directive (RoHS compliant) of the European Parliament.

About CPS Technologies Corporation

CPS Technologies Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. CPS uses a net-shape fabrication process, including patented QuickSet™ injection molding and QuickCast™ infiltration. AlSiC components are used in applications in the Wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS is a publicly traded company (symbol “CPSH”). CPS customers include TI, Motorola, HP, Agilent and Amkor. For more information on CPS AlSiC components, contact Mark Occhionero at 1 (508) 222-0614 x 242; e-mail marko@alsic.com, or visit www.alsic.com.